NGSFP MSA Work Group Release the First Specifications

Date: Jan. 6th 2020

    [Shenzhen, China, December 27, 2019] At the face-to-face work discussion of the NGSFP MSA working group on December 27, 2019, the participating members summarized the preliminary work of the NGSFP MSA and discussed the stage of the working group. The text of "NGSFP Module Specification 1.0" was reviewed. After careful discussion by the experts of the participating member units, it was agreed that the text of "NGSFP Module Specification 1.0" (NGSFP Module Specification Rev 1.0) meets the working requirements of the working group in the early stage, reached the first stage of the working group, and agreed to release "NGSFP Module Specification 1.0" (NGSFP Module Specification Rev 1.0) text.

Picture: NGSFP MSA working group face-to-face meeting with group members

The members of the NGSFP MSA working group face-to-face meeting also discussed the working contents and plan of the next stage of the working group, and will continue to contribute to the development of NGSFP MSA work.

About NGSFP MSA Working Group

NGSFP (Next Generation SFP Multisource Agreement) MSA Working Group was initiated at the China International Optoelectronic Exposition (CIOE) on September 5th by Huawei, Baidu, Tencent, Accelink, AOI, Broadex, CZT, Hisense Broadband, HiSilicon, Leoni, Source Photonics, Luxshare,Tri-Light, Yamaichi Electronics to jointly promote the development of the next-generation high-density miniaturized optical module packaging and interface industry specifications.

Current NGSFP MSA members include

Promoters: Huawei, Baidu, Tencent, Accelink, AOI, Broadex, CZT, Hisense Broadband, HiSilicon, Leoni, Source Photonics, Luxshare,Tri-Light, Yamaichi Electronics

Contributors: CIG, Eoptolink, Foxconn Interconnect Technology, HGTECH, Sumitomo Electric

For more information, please visit: www.ngsfpmsa.com